Fasahar tsaftacewa ta LaserAmfani da fasahar laser mai nasara ne a fannin injiniya. Babban ƙa'idarsa tana amfani da ƙarfin laser mai yawa don ba da damar hulɗa tsakanin hasken laser da gurɓatattun abubuwa da ke manne da abubuwan da aka yi amfani da su a cikin kayan aiki. Ana raba gurɓatattun abubuwa daga abubuwan da aka yi amfani da su ta hanyar faɗaɗa zafi nan take, narkewa, gurɓataccen iskar gas da sauran hanyoyin. Tare da babban inganci, aminci ga muhalli da kiyaye makamashi, fasahar tsaftacewar laser an yi amfani da ita cikin nasara a cikin tsaftace taya, cire fenti a jikin jiragen sama, dawo da kayan tarihi na al'adu da sauran fannoni.
Fasahar tsaftacewa ta gargajiya ta haɗa da tsaftace gogayya ta injiniya (fashewar yashi, tsaftace ruwa mai matsin lamba, da sauransu), tsaftace tsatsa ta sinadarai, tsaftace ultrasonic, tsaftace kankara busasshe da ƙari. Ana amfani da waɗannan fasahohin sosai a masana'antu. Misali, fashewar yashi na iya cire tabo na ƙarfe, burrs na saman da kuma rufin tsari akan allon da'ira ta hanyar zaɓar goge-goge masu tauri daban-daban. Ana amfani da tsaftace tsatsa ta sinadarai sosai don cire ma'aunin mai na saman kayan aiki, tsaftace ma'aunin boiler da kuma buɗe bututun mai. Duk da yake sun girma, hanyoyin gargajiya suna da manyan abubuwan da ba su da kyau: fashewar yashi yana lalata saman da aka yi wa magani cikin sauƙi, kuma tsaftace tsatsa ta sinadarai yana haifar da gurɓataccen muhalli kuma yana iya lalata substrates idan ba a yi amfani da su yadda ya kamata ba. Bayyanar tsaftace laser alama ce ta juyin juya hali a fasahar tsaftacewa. Yin amfani da yawan kuzari mai yawa na laser, daidaito da ingantaccen watsawa, tsaftace laser ya fi hanyoyin gargajiya kyau wajen tsaftace inganci, daidaito da matsayi. Yana kawar da gurɓataccen muhalli daga tsaftace sinadarai kuma ba ya haifar da lalacewa ga substrates.
Ka'idojin Tsaftace Laser
Menene ainihin tsaftace laser? Yana nufin tsarin cire kayan daga saman daskararru (ko kuma wani lokacin ruwa) ta hanyar hasken laser. A lokacin da hasken laser ya yi ƙasa, makamashin laser da aka sha yana dumama kayan, yana haifar da ƙafewa ko sublimation. A lokacin da hasken laser ya yi yawa, kayan yawanci suna canzawa zuwa plasma. Tsaftace laser yawanci yana amfani da lasers masu pulsed don cire kayan, kodayake hasken laser mai ci gaba da raƙuman ruwa na iya lalata kayan da isasshen ƙarfi. Ana amfani da lasers masu zurfin ultraviolet, tare da raƙuman ruwa kusan 200 nm, galibi don ɗaukar hoto.
Zurfinmakamashin laserSha da adadin kayan da aka cire a kowace bugun jini ya dogara ne akan halayen gani na kayan, da kuma tsawon laser da tsawon bugun jini. Jimlar nauyin da aka cire daga manufa a kowace bugun jini an bayyana shi azaman ƙimar cirewa. Halayen hasken laser kamar saurin dubawa da rufe layi suna tasiri sosai kan tsarin cirewa.
Nau'ikan Fasahar Tsaftace Laser
1) Tsaftace Busasshen Laser
Tsaftace busasshen laser yana buƙatarHasken Laser kai tsaye na kayan aiki. Gurɓata ko substrates suna shan makamashin Laser, suna ɗaga zafinsu kuma suna haifar da faɗaɗa zafin jiki ko girgizar zafi ta substrates, wanda ke raba gurɓatawa daga substrates. Yana faruwa a yanayi biyu: ko dai gurɓatattun abubuwa a saman suna shan makamashin Laser kuma suna faɗaɗa, ko kuma substrates suna shan makamashi kuma suna girgiza ta hanyar zafi.
A shekarar 1969, SM Bedair da abokan aikinsa sun gano cewa maganin saman da aka saba amfani da shi (maganin zafi, lalata sinadarai, da kuma lalata yashi) duk suna da iyaka. Sun lura cewa yawan kuzarin da lasers ɗin da aka mayar da hankali a kai zai iya tururi kayan saman ba tare da lalata substrates ba. Gwaje-gwaje sun tabbatar da cewa laser mai siffar Q-switched ruby mai ƙarfin 30 MW/cm² zai iya tsaftace gurɓatattun abubuwa daga saman silicon ba tare da lalacewar substrates ba, wanda hakan ya nuna aiwatar da farko na tsabtace busasshen laser.
Ana iya bayyana jimlar yawan tsaftacewa ta hanyar rage yawan tarkacen fim ɗin, kamar yadda aka nuna a ƙasa:
(Tsarin: ε—ma'aunin kuzarin bugun jini na laser; h—ma'aunin kauri na fim mai gurɓatawa; ma'aunin modulus na roba na E)
2) Tsaftace Rigar Laser
Kafin a yi amfani da hasken laser mai ƙarfi, ana shafa fim ɗin ruwa a saman aikin. Ƙarfin Laser yana dumama fim ɗin da sauri kuma yana tururi, yana samar da girgiza nan take wanda ke cire ƙwayoyin da ke gurɓata daga substrate. Wannan hanyar ba ta buƙatar wani abu mai guba tsakanin substrate da fim ɗin ruwa, wanda ke iyakance kayan da ake amfani da su.
A shekarar 1991, K. Imen da abokan aikinsa sun magance gurɓatattun abubuwa da suka rage a kan wafers na semiconductor da ƙarfe bayan an yi musu tsaftacewa ta al'ada. Sun shafa wa substrates ɗin da fim ɗin da ke sha da laser sannan suka haskaka shi da laser na CO₂. Fim ɗin ya sha makamashi, ya yi zafi da sauri, ya tafasa kuma ya yi tururi mai ƙarfi, yana cire gurɓatattun abubuwa a saman - wannan yana bayyana tsaftacewar da aka yi da laser.
3) Tsaftace Girgizar Jiki ta Laser Plasma
Tashin hankali na plasma na Laser yana samuwa ne lokacin da lasers ke mayar da iska zuwa cikin ion shockwaves na plasma mai zagaye yayin hasken rana. Waɗannan tashin hankali suna buga substrates, suna fitar da makamashi don cire gurɓatattun abubuwa ba tare da lalata substrates ba (laser ba sa hulɗa kai tsaye da substrates). Wannan fasaha tana tsaftace barbashi ƙanana kamar goma na nanometers kuma ba ta sanya wani ƙuntatawa akan tsawon laser ba.
An taƙaita ƙa'idodin zahiri na tsabtace plasma kamar haka:
a) Ana shanye hasken laser ta hanyar layin gurɓataccen abu da ke kan saman da aka nufa.
b) Shan makamashi mai yawa yana samar da iskar plasma mai faɗaɗa da sauri (iskar da ba ta da ƙarfi sosai mai ion), tana haifar da girgizar ƙasa.
c) Yana cire gurɓatattun abubuwa masu guba da kuma cire su daga jiki.
d) Dole ne bugun laser ya kasance gajere don guje wa tarin zafi da ke lalata substrate.
e) Gwaje-gwaje suna nuna siffofin plasma a saman ƙarfe lokacin da akwai oxides.
Samar da sinadarin plasma yana faruwa ne kawai a saman matakin yawan kuzari, wanda ya dogara da layin gurɓataccen abu ko iskar oxide da za a cire. Akwai wani matakin mafi girma na biyu, wanda bayan haka substrate ɗin ya lalace. Don tabbatar da tsaftacewa mai inganci ba tare da lahani ga substrate ba, dole ne a daidaita sigogin laser don kiyaye yawan kuzarin bugun jini tsakanin matakan biyu.
A shekara ta 2001, JM Lee da abokan aikinsa sun yi amfani da tasirin girgizar plasma daga na'urorin laser masu ƙarfin gaske. Wani na'urar laser mai ƙarfin kuzari mai nauyin 2.0 J/cm² (wanda ya zarce iyakar lalacewar silicon) ta yi amfani da wafers ɗin silicon a lokaci guda, inda ta yi nasarar cire ƙwayoyin tungsten 1 μm. A taƙaice dai, tsaftace girgizar plasma ta laser wani ɓangare ne na tsaftacewar busasshiyar hanya.
Da farko an ƙera su ne don cire ƙananan ƙwayoyin cuta daga wafers na semiconductor, waɗannan fasahohin tsaftacewa na laser guda uku sun faɗaɗa zuwa tsaftace mold na taya, cire fenti na fata na jirgin sama, dawo da kayan tarihi na al'adu da ƙari. Ana iya hura iskar gas mara aiki a kan substrates yayin amfani da laser don cire gurɓatattun abubuwa nan take, hana gurɓatawa da kuma oxidation.
Aikace-aikacen Fasahar Tsaftace Laser
1) Masana'antar Semiconductor: Tsaftace Wafers na Semiconductor da Substrates na gani
Wafers na Semiconductor da substrates na gani suna fuskantar matakai iri ɗaya na sarrafawa (yanka, niƙa) don samar da siffofi da ake so, suna gabatar da gurɓatattun abubuwa waɗanda ke da wahalar cirewa da kuma saurin gurɓatawa. Gurɓatattun abubuwa da ke kan wafers suna lalata ingancin bugawar da'ira kuma suna rage tsawon rayuwar guntu. A kan wafers na gani, suna lalata aikin na'urar gani da shafi, suna haifar da rashin daidaiton rarraba makamashi da raguwar tsawon sabis.
Ba kasafai ake amfani da goge busasshen laser a nan ba saboda haɗarin lalacewar substrate, yayin da tsaftacewar danshi da tsaftacewar girgizar plasma suna da aikace-aikace da yawa masu nasara. Xu Chuanyi da abokan aikinsa sun ajiye fenti mai girman micron a matsayin fim ɗin dielectric akan substrates masu santsi sosai, wanda ya sami ingantaccen tsaftacewar laser mai bugun zuciya. Duk da cewa ƙwayoyin ƙazanta sun ƙaru, girmansu da rufinsu sun ragu sosai. Zhang Ping ya yi nazarin tasirin nisan aiki da kuzarin laser akan ingancin tsaftacewa ga barbashi masu girma dabam-dabam. Gwaje-gwaje sun nuna cewa laser 240 mJ ya sami ingantaccen tsaftacewa na barbashi na polystyrene akan gilashin sarrafawa a nisan aiki na 1.90 mm. Inganta tsaftacewa ya inganta tare da ƙarin kuzarin laser, kuma manyan barbashi sun fi sauƙin cirewa.
2) Masana'antar Karfe: Tsaftace saman Karfe
Tsaftace saman ƙarfe yana kai hari ga gurɓatattun abubuwa masu yawa: yadudduka na oxide/tsatsa, fenti, shafi da sauran abubuwan da aka haɗa, waɗanda aka rarraba su azaman gurɓatattun abubuwa na halitta (fenti, shafi) ko gurɓatattun abubuwa marasa tsari (tsatsa). Tsaftacewa yana cika buƙatun sarrafawa/amfani na gaba: misali, cire yadudduka na oxide mai kauri μm 10 daga ƙarfen titanium kafin walda, cire fenti daga fatar jirgin sama don sake fenti, da tsaftace ragowar roba daga ƙurar taya don tabbatar da ingancin samfur da tsawon rayuwar ƙurar.
Karfe yana da matakan lalacewa mafi girma fiye da matakan tsaftacewar gurɓataccen abu, wanda ke ba da damar tsaftacewa mai inganci tare da laser mai ƙarfi. Aikace-aikacen da suka dace sun haɗa da: Wang Lihua et al. sun nuna cewa laser 5.1 J/cm² ya cire yadudduka na oxide daga ƙarfen aluminum na A5083-111H yayin da yake kiyaye ingancin substrate, da kuma laser mai ƙarfin 100 W wanda aka goge yadda ya kamata tare da ingantaccen taurin saman. Masu kera na cikin gida (Raycus Laser, Han's Laser, Shenzhen Chuangxin) suna ba da kayan aikin tsaftacewa na laser don molds na roba, tsatsa na ƙarfe da cire mai daga wani ɓangare.
3) Kiyaye Kayan Tarihi na Al'adu: Tsaftace Kayan Tarihi na Al'adu da Kayan Tarihi na Takarda
Abubuwan tarihi na ƙarfe da dutse suna tara datti, tabon tawada da sauran gurɓatattun abubuwa a tsawon lokaci, wanda ke buƙatar a cire su don dawo da kamanninsu na asali. Abubuwan tarihi na takarda (zane-zane, zane-zanen rubutu) suna haifar da mold da plaques yayin adanawa mara kyau, wanda hakan ke lalata yanayinsu da darajar al'adu/ta tarihi sosai.
Zhao Ying da abokan aikinsa sun tabbatar da tsaftace allon mold a kan takardar shinkafa ta hanyar amfani da laser na UV: hoton da aka yi a 3.2 J/mm² ya cire siririn allon, yayin da hotunan biyu suka sami nasarar cirewa gaba ɗaya; ƙarfin laser mai yawa ya lalata takardar. Zhang Xiaotong ya yi nasarar gyara wani kayan tarihi na tagulla mai zinare ta amfani da hanyar laser mai laushi. Zhang Licheng ya shafa tsaftace laser a kan wani mutum-mutumin tukwane na mace da aka fenti daga Daular Han. Yuan Xiaodong da abokan aikinsa sun kimanta ingancin tsaftace laser don kayan tarihi na dutse, suna kwatanta lalacewar substrate da ingancin cirewa don tawada, hayaki da tabo a kan dutse mai yashi.
Kammalawa
Tsaftace Laser fasaha ce mai ci gaba wacce ke da fa'ida a fannin bincike da aikace-aikace a fannin sararin samaniya, kayan aikin soja, kayan lantarki da sauran fannoni masu inganci. Ya girma a masana'antu da dama saboda ingancinsa, kyawun muhalli da kuma ingantaccen sakamakon tsaftacewa, aikace-aikacensa na ci gaba da faɗaɗawa. Bayan cire fenti da tsatsa da aka kafa, ci gaban da aka samu kwanan nan ya haɗa da tsaftace laser na yadudduka na oxide akan wayoyin ƙarfe. Ci gaban nan gaba ya dogara ne akan faɗaɗa aikace-aikacen da ake da su, shiga sabbin fannoni da kuma ƙirƙirar kayan aiki:
- Ƙarfafa binciken ka'idoji don jagorantar aikace-aikace na aiki. Binciken da ake yi a yanzu ya dogara ne sosai akan gwaje-gwaje, ba tare da tsarin ka'idoji mai girma ba. Kafa irin wannan tsarin yana da matuƙar muhimmanci ga balaga ta fasaha.
- Faɗaɗa aikace-aikace a fannoni da ake da su da kuma sababbi. An yi amfani da su wajen cire fenti/tsatsa, waɗanda suka haɗa da tsaftace waya ta ƙarfe, wanda ke samar da ƙasa mai kyau don girma.
- Ƙirƙiri sabbin kayan aikin tsaftacewa na laser, waɗanda suka bambanta zuwa na'urori masu amfani da yawa (misali, haɗa fenti/cire tsatsa) da kayan aiki na musamman (misali, kayan aiki/zare na musamman don wurare masu iyaka). Cikakken aiki da kansa ta hanyar haɗawa da robots na masana'antu alkibla ce mai kyau.
Lokacin Saƙo: Mayu-14-2026
