Ka'ida, nau'ikan da aikace-aikacentsaftacewar laserfasaha
Fasahar tsaftace laser wata hanya ce mai nasara ta amfani da fasahar laser a fannin injiniyanci. Babban manufarta ita ce amfani da yawan makamashin laser mai yawa don mu'amala da gurɓatattun abubuwa da ke manne da substrate na aikin, wanda hakan ke sa su rabu da substrate ta hanyar faɗaɗa zafi nan take, narkewa, da kuma fitar da iskar gas. Fasahar tsaftace laser tana da inganci sosai, kyawun muhalli, da kuma kiyaye makamashi. An yi amfani da ita cikin nasara a fannoni kamar tsaftace taya, cire fenti a jikin jiragen sama, da kuma dawo da kayan tarihi na al'adu.
Fasahohin tsaftacewa na gargajiya sun haɗa datsaftacewar gogayya ta inji(tsabtace yashi, tsaftace ruwa mai matsin lamba, da sauransu), tsaftace tsatsa ta sinadarai, tsaftace ultrasonic, tsaftace kankara busasshe, da sauransu. An yi amfani da waɗannan fasahohin tsaftacewa sosai a masana'antu daban-daban. Misali, tsaftace yashi na iya cire tabo na ƙarfe, burrs na saman ƙarfe, da varnish mai hana ruwa uku a kan allunan da'ira ta hanyar zaɓar goge-goge masu tauri daban-daban. Ana amfani da fasahar tsabtace tsatsa ta sinadarai sosai wajen tsaftace tabo mai a saman kayan aiki, sikelin boilers, da bututun mai. Duk da cewa an haɓaka waɗannan fasahohin tsaftacewa sosai, har yanzu suna da wasu matsaloli. Misali, tsaftace yashi na iya haifar da lalacewa ga saman da aka yi wa magani cikin sauƙi, kuma tsaftace tsatsa ta sinadarai na iya haifar da gurɓataccen muhalli da tsatsa na saman da aka tsaftace idan ba a kula da shi yadda ya kamata ba. Bayyanar fasahar tsaftacewa ta laser tana wakiltar juyin juya hali a fasahar tsaftacewa. Tana amfani da yawan kuzari mai yawa, daidaito mai yawa, da ingantaccen watsa makamashin laser, kuma tana da fa'idodi bayyanannu akan fasahar tsaftacewa ta gargajiya dangane da ingancin tsaftacewa, daidaiton tsaftacewa, da wurin tsaftacewa. Zai iya guje wa gurɓataccen muhalli da tsaftacewar tsatsa ta sinadarai da sauran fasahohin tsaftacewa ke haifarwa yadda ya kamata, kuma ba zai haifar da lalacewa ga substrate ba.
To menene tsaftace laser? Tsaftace laser tsari ne inda ake amfani da hasken laser don cire abu daga saman wani abu mai ƙarfi (ko wani lokacin ruwa). A lokacin da hasken laser ya yi ƙasa, kayan yana dumama ta hanyar ƙarfin laser da aka sha kuma yana ƙafewa ko kuma yana ƙafewa. A lokacin da hasken laser ya yi yawa, kayan yawanci suna komawa zuwa plasma. Yawanci, tsaftacewar laser tana nufin cire abu ta amfani da hasken laser mai ƙarfi, amma idan ƙarfin laser ya isa, ana iya amfani da hasken laser mai ƙarfi mai ci gaba don cire kayan. Ana amfani da hasken ultraviolet mai zurfi don cire haske. Tsawon laser da ake amfani da shi don cire haske shine kimanin 200nm. Zurfin shaƙar makamashin laser da adadin kayan da bugun laser guda ɗaya ya cire ya dogara da halayen gani na kayan, da kuma tsawon laser da tsawon bugun. Jimlar nauyin da aka cire daga abin da aka nufa ta kowace bugun laser yawanci ana kiransa ƙimar cirewa. Saurin duba hasken laser da murfin layin duba, da sauransu, zai yi tasiri sosai kan tsarin cirewa.
Nau'ikan Fasahar Tsaftace Laser
1) Tsaftace busasshen Laser: Tsaftace busasshen laser yana nufin haskakawa kai tsaye na kayan aikin tsaftacewa ta hanyar laser mai pulsed, wanda ke haifar da gurɓatattun tushe ko saman su sha makamashi da ƙaruwar zafin jiki, wanda ke haifar da faɗaɗa zafi ko girgizar zafi na tushe, ta haka ne raba su biyun. Wannan hanyar za a iya raba ta zuwa yanayi biyu: ɗaya shine cewa gurɓatattun saman suna shan makamashin laser kuma suna faɗaɗa; ɗayan kuma shine cewa tushe yana shan makamashin laser kuma yana haifar da girgizar zafi. A cikin 1969, SM Bedair et al. sun gano cewa hanyoyin magance saman daban-daban kamar maganin zafi, lalata sinadarai, da tsaftace yashi duk suna da matsaloli daban-daban. A lokaci guda, yawan kuzari bayan mayar da hankali kan laser na iya sa lamarin fitar da iskar sama ya yiwu, wanda ke ba da damar yin tsaftacewa mara lalata saman kayan. Ta hanyar gwaje-gwaje, an gano cewa amfani da laser mai ruby Q-switched tare da ƙarfin ƙarfin 30 MW/cm2 na iya cimma tsaftace gurɓatattun saman kayan silicon ba tare da lalata tushe ba, kuma a karon farko, an gano tsaftace busasshen laser na gurɓatattun saman kayan. Ana iya bayyana jimlar ƙimar ta hanyar rage girman ɓangarorin Layer na fim ɗin, kamar haka:
A cikin dabarar, ε yana wakiltar ma'aunin kuzarin bugun laser, h yana wakiltar ma'aunin kauri na layin fim ɗin gurɓata, kuma E yana wakiltar ma'aunin modulus mai laushi na layin fim ɗin.
2) Tsaftace Rigar Laser: Kafin a fallasa kayan aikin da za a tsaftace ga laser mai pulsed, ana shafa fim ɗin ruwa mai rufe saman. A ƙarƙashin aikin laser, zafin fim ɗin ruwa yana tashi da sauri kuma yana tururi. A lokacin tururi, ana samar da raƙuman tasiri, wanda ke aiki akan ƙwayoyin gurɓataccen abu kuma yana sa su rabu daga substrate. Wannan hanyar tana buƙatar substrate da fim ɗin ruwa ba sa yin hulɗa da juna, don haka yana iyakance kewayon kayan da suka dace. A cikin 1991, K. Imen et al. sun magance matsalar gurɓataccen ɓangaren sub-micron da ya rage a saman wafers na semiconductor da kayan ƙarfe bayan an yi amfani da hanyoyin tsaftacewa na gargajiya, kuma sun yi nazarin amfani da shafa fim a saman substrate wanda zai iya shan kuzarin laser yadda ya kamata. Daga baya, ta amfani da laser CO2, fim ɗin ya sha ƙarfin laser kuma ya karu da sauri a zafin jiki kuma ya tafasa, yana haifar da tururi mai fashewa, wanda ya cire gurɓatattun abubuwa daga saman substrate. Wannan hanyar tsaftacewa ana kiranta tsaftacewar laser rigar.
3) Tsaftace Wave na Laser na Laser: Ana samar da raƙuman girgiza na plasma lokacin da laser ya haskaka yanayin iska kuma ya haifar da ƙirƙirar raƙuman girgiza na plasma mai zagaye. Raƙuman girgiza suna aiki akan saman kayan aikin don a tsaftace su kuma suna fitar da kuzari don cire gurɓatattun abubuwa. Laser ɗin baya aiki akan substrate, don haka baya haifar da lahani ga substrate. Fasahar tsaftacewar raƙuman girgiza na plasma na laser yanzu zata iya tsaftace barbashi masu diamita na 100 na nanometers, kuma babu ƙuntatawa akan tsawon laser. Ana iya taƙaita ƙa'idar zahiri ta tsaftacewar plasma kamar haka: a) Raƙuman laser da laser ke fitarwa yana sha ta hanyar Layer ɗin gurɓatawa akan saman da aka yi wa magani. b) Yawan sha yana samar da plasma mai faɗaɗa da sauri (iskar da ba ta da ƙarfi sosai) kuma yana haifar da raƙuman tasiri. c) Raƙuman tasiri yana sa gurɓatattun abubuwa su wargaje kuma a cire su. d) Faɗin bugun bugun haske dole ne ya zama gajere don guje wa tarin zafi wanda zai iya lalata saman da aka yi wa magani. e) Gwaje-gwaje sun nuna cewa lokacin da akwai oxides akan saman ƙarfe, ana samar da plasma akan saman ƙarfe. Ana samar da plasma ne kawai lokacin da yawan kuzari ya wuce iyakar, wanda ya dogara da layin gurɓatawa ko layin oxide da aka cire. Wannan tasirin iyaka yana da matukar muhimmanci don tsaftacewa mai inganci yayin da ake tabbatar da amincin kayan substrate. Bayyanar plasma kuma tana da iyaka ta biyu. Idan yawan kuzari ya wuce wannan iyaka, kayan substrate zai lalace. Don yin tsaftacewa mai inganci yayin tabbatar da amincin kayan substrate, dole ne a daidaita sigogin laser bisa ga yanayin don tabbatar da cewa yawan kuzarin bugun haske yana tsakanin iyakokin biyu. A cikin 2001, JM Lee et al. sun yi amfani da halayyar cewa lasers masu ƙarfi suna samar da raƙuman girgiza na plasma lokacin da aka mai da hankali, kuma sun yi amfani da laser bugun jini tare da yawan kuzari na 2.0 J/cm2 (fiye da iyakar lalacewa na wafers na silicon) don haskakawa daidai da wafer silicon, wanda ya yi nasarar tsaftace barbashi tungsten 1 μm da aka lulluɓe a saman wafer silicon. Wannan hanyar tsaftacewa ana kiranta tsaftacewar raƙuman girgiza na plasma na laser, kuma a zahiri, tsaftacewar raƙuman girgiza na plasma na laser nau'in tsaftacewar laser busasshe ne. Asalin manufar waɗannan fasahohin tsaftacewa na laser guda uku ita ce tsaftace ƙananan barbashi a saman wafers na semiconductor. Ana iya cewa fasahar tsaftacewa ta laser ta fito ne tare da haɓaka fasahar semiconductor. Duk da haka, ana ci gaba da amfani da fasahar tsaftacewa ta laser a wasu fannoni, kamar tsaftace mold na taya, cire fenti na fata na jirgin sama, da kuma dawo da saman kayan tarihi. Yayin da ake amfani da hasken laser, ana iya hura iskar gas mara aiki a saman substrate. Lokacin da aka cire gurɓatattun abubuwa daga saman, nan da nan gas ɗin zai hura su daga saman don guje wa sake gurɓatawa da kuma lalata saman.
Theamfani da fasahar tsaftacewa ta laser
1) A fannin semiconductor, tsaftace wafers na semiconductor da substrates na gani ya ƙunshi irin wannan tsari, wanda shine sarrafa kayan da ake buƙata ta hanyar yankewa, niƙawa, da sauransu. A yayin wannan tsari, ana shigar da gurɓatattun abubuwa, waɗanda ke da wahalar cirewa kuma suna haifar da matsalolin gurɓatawa masu yawa. Gurɓatattun abubuwa a saman wafers na semiconductor na iya shafar ingancin bugawar allon kewaye, ta haka yana rage tsawon rayuwar guntun semiconductor. Gurɓatattun abubuwa a saman wafers na gani na iya shafar ingancin na'urorin gani da rufi, kuma yana iya haifar da rashin daidaiton rarraba makamashi, yana rage tsawon rai. Tunda tsaftacewar bushewa ta laser tana da saurin haifar da lalacewa ga saman substrate, wannan hanyar tsaftacewa ba a amfani da ita sosai wajen tsaftace wafers na semiconductor da substrates na gani. Tsaftacewar Laser da tsaftacewar raƙuman laser na plasma suna da aikace-aikace mafi nasara a wannan fanni. Xu Chuanyi et al. sun yi nazarin adana fenti na musamman na maganadisu a saman wafers na gani mai santsi a matsayin fim ɗin dielectric, sannan suka yi amfani da laser mai pulsed don tsaftacewa. Tasirin tsaftacewa ya yi kyau, duk da cewa adadin ƙwayoyin datti a kowace yanki ya ƙaru, girman da yankin rufewar ƙwayoyin dattin ya ragu sosai. Wannan hanyar za ta iya tsaftace ƙananan ƙwayoyin dattin da ke saman ƙananan ƙwayoyin dattin da ke da santsi sosai. Zhang Ping ya yi nazarin tasirin nisan aiki da kuzarin laser akan tasirin tsaftacewa na gurɓatattun ƙwayoyin da ke da girman ƙwayoyin datti daban-daban a cikin fasahar tsaftacewar plasma ta laser. Sakamakon gwaji ya nuna cewa ga ƙwayoyin polystyrene akan gurɓatattun gilashin da ke da iko, mafi kyawun nisan aiki don kuzarin 240 mJ shine 1.90 mm. Yayin da ƙarfin laser ya ƙaru, tasirin tsaftacewa ya inganta sosai, kuma manyan gurɓatattun ƙwayoyin dattin sun fi sauƙin tsaftacewa.
2) A fannin kayan ƙarfe, tsaftace saman kayan ƙarfe ya bambanta da tsaftace wafers na semiconductor da substrates na gani. Gurɓatattun da za a tsaftace suna cikin nau'in macroscopic. Gurɓatattun da ke saman kayan ƙarfe sun haɗa da Layer oxide (Layer tsatsa), Layer fenti, shafi, da sauran abubuwan haɗe-haɗe, kuma ana iya rarraba su zuwa gurɓatattun abubuwa na halitta (kamar Layer fenti, shafi) da gurɓatattun abubuwa marasa halitta (kamar Layer tsatsa). Tsaftace gurɓatattun abubuwa na saman kayan ƙarfe galibi don biyan buƙatun sarrafawa ko amfani na gaba, kamar cire kusan μm 10 na Layer oxide daga saman sassan titanium alloy kafin walda, cire fenti na asali akan saman fata yayin manyan gyare-gyare na jirgin sama don sauƙaƙe sake fesawa, da kuma tsaftace barbashin roba da aka haɗa da mold ɗin taya na roba akai-akai don tabbatar da tsaftar saman da inganci da tsawon rai na mold. Matsakaicin lalacewa na kayan ƙarfe ya fi na matakin tsaftacewar laser na gurɓatattun su na saman. Ta hanyar zaɓar laser mai ƙarfi mai dacewa, ana iya samun ingantaccen tasirin tsaftacewa. An yi amfani da wannan fasaha sosai a wasu fannoni. Wang Lihua et al. An yi nazarin amfani da fasahar tsaftace laser wajen magance fatar oxide a saman aluminum da titanium. Sakamakon binciken ya nuna cewa amfani da laser mai ƙarfin kuzari na 5.1 J/cm2 zai iya tsaftace Layer ɗin oxide a saman aluminum A5083-111H yayin da yake kiyaye ingancin substrate mai kyau, kuma amfani da laser mai ƙarfin 100 W ta hanyar dubawa zai iya tsaftace Layer ɗin oxide a saman titanium da inganta taurin saman kayan. Kamfanonin cikin gida kamar Ruike Laser, Daqu Laser, da Shenzhen Chuangxin sun ƙirƙiro kayan aikin tsaftacewa na laser waɗanda aka yi amfani da su sosai don tsaftace molds na roba kamar tayoyi, yadudduka na tsatsa na ƙarfe, da tabon mai a saman kayan.
3) A fannin kayan tarihi na al'adu, tsaftace kayan tarihi na ƙarfe da dutse da saman takarda ya zama dole don cire gurɓatattun abubuwa kamar tabo da tabo na tawada da ke bayyana a saman su saboda dogon tarihin su. Waɗannan gurɓatattun abubuwa suna buƙatar a cire su don dawo da kayan tarihi. Ga ayyukan takarda kamar zane-zane da zane-zane, idan aka adana su ba daidai ba, mold yana tsiro a saman su kuma yana samar da tabo. Waɗannan tabo suna shafar asalin bayyanar takardar, musamman ga takarda mai ƙimar al'adu ko tarihi, wanda zai shafi godiya da kariyar ta. Zhao Ying da sauransu sun yi nazarin yuwuwar amfani da laser na ultraviolet don tsaftace tabo na mold a kan takarda. Sakamakon gwaji ya nuna cewa amfani da laser mai yawan kuzari na 3.2 J/mm2 don duba sau ɗaya zai iya cire siraran tabo, kuma duba sau biyu zai iya cire tabo gaba ɗaya. Duk da haka, idan ƙarfin laser da aka yi amfani da shi ya yi yawa, zai lalata gungumen takarda yayin cire tabo. Zhang Xiaotong da sauransu sun yi nasarar dawo da wani gungumen tagulla mai zinare ta amfani da hanyar fim ɗin ruwa mai haske na laser a tsaye. Zhang Licheng da sauransu sun yi amfani da fasahar tsaftacewa ta laser wajen dawo da siffar tukwane ta mace da aka fentin a Daular Han. Yuan Xiaodong da sauransu sun yi nazarin tasirin fasahar tsaftace laser wajen tsaftace kayan tarihi na dutse kuma sun kwatanta lalacewar da ta shafi jikin dutsen yashi kafin da kuma bayan tsaftacewa, da kuma tasirin tsaftacewar tabo na tawada, gurɓatar hayaki, da gurɓatar fenti.
Kammalawa: Fasahar tsaftace laser wata dabara ce mai ci gaba, tare da faffadan bincike da amfani a fannoni masu inganci kamar su sararin samaniya, kayan aikin soja, da injiniyan lantarki da lantarki. A halin yanzu, an yi amfani da fasahar tsaftace laser cikin nasara a wasu fannoni, godiya ga ingantaccen aikin tsaftacewarta, mai kyau ga muhalli, da kuma kyakkyawan aikin tsaftacewa. Yankunan aikace-aikacenta suna faɗaɗa a hankali. Ci gaban fasahar tsaftace laser ba wai kawai an yi amfani da ita ba ne a fannoni kamar cire fenti da cire tsatsa, har ma an sami rahotannin amfani da laser don tsaftace layin oxide akan wayoyin ƙarfe a cikin 'yan shekarun nan. Faɗaɗa filayen aikace-aikacen da ake da su da haɓaka sabbin fannoni su ne ginshiƙin ci gaban fasahar tsaftace laser. Bincike da haɓaka sabbin kayan aikin tsaftace laser da haɓaka sabbin kayan aikin tsaftacewa laser za su nuna bambance-bambance, wanda ke haifar da ayyuka daban-daban. A nan gaba, cimma cikakken tsaftacewar laser ta atomatik ta hanyar haɗin gwiwa da robots na masana'antu shi ma ana iya cimma shi. Tsarin haɓaka fasahar tsaftace laser kamar haka:
(1) Ƙarfafa bincike kan ka'idar tsaftace laser don jagorantar amfani da fasahar tsaftace laser. Bayan duba takardu da yawa, an gano cewa babu wani tsarin ka'idar da ya girma wanda ke tallafawa fasahar tsaftace laser, kuma yawancin nazarin sun dogara ne akan gwaje-gwaje. Kafa tsarin ka'idar tsaftace laser shine ginshiƙin ci gaba da balaga fasahar tsaftace laser.
(2) Faɗaɗa filayen aikace-aikacen da ake da su da sabbin filayen aikace-aikacen. An yi amfani da fasahar tsaftacewar laser cikin nasara a fannoni kamar cire fenti da cire tsatsa, kuma an sami rahotannin amfani da laser don tsaftace layin oxide akan wayoyin ƙarfe a cikin 'yan shekarun nan. Faɗaɗa filayen aikace-aikacen da ake da su da kuma haɓaka sabbin filayen sune ƙasa mai kyau don haɓaka fasahar tsaftacewar laser.
(3) Bincike da haɓaka sabbin kayan aikin tsaftacewa na laser. Haɓaka sabbin kayan aikin tsaftacewa na laser zai nuna bambance-bambance. Nau'i ɗaya shine kayan aiki waɗanda ke da takamaiman abu ɗaya wanda ya shafi fannoni daban-daban na aikace-aikace, kamar na'ura ɗaya za ta iya cimma ayyukan cire fenti da cire tsatsa a lokaci guda. Nau'in kuma shine kayan aiki na musamman don takamaiman buƙatu, kamar ƙira takamaiman kayan aiki ko zare na gani don cimma aikin tsaftace gurɓatattun abubuwa a ƙananan wurare. Ta hanyar haɗin gwiwa da robots na masana'antu, tsaftacewar laser ta atomatik gaba ɗaya ita ce sanannen hanyar amfani.
Lokacin Saƙo: Yuli-17-2025
