Duk da cewa na'urorin laser masu saurin gaske sun kasance a cikin shekaru da dama, aikace-aikacen masana'antu sun bunƙasa cikin sauri a cikin shekaru ashirin da suka gabata. A cikin 2019, darajar kasuwa ta na'urorin laser masu saurin gaskekayan laserTsarin sarrafawa ya kai kimanin dala miliyan 460 na Amurka, tare da karuwar ci gaba a kowace shekara da kashi 13%. Wuraren da aka yi amfani da su wajen sarrafa kayan masana'antu sun haɗa da ƙera abin rufe fuska da gyara a masana'antar semiconductor da kuma yanke silicon, yanke/rubuta gilashi da kuma cire fim ɗin ITO (indium tin oxide) a cikin kayan lantarki na masu amfani kamar wayoyin hannu da Allunan, rubutun piston na masana'antar kera motoci, masana'antar stent na coronary da kuma kera na'urorin microfluidic don masana'antar likitanci.
01 ƙera da gyara Photomask a masana'antar semiconductor
An yi amfani da na'urorin laser masu sauri a cikin ɗaya daga cikin aikace-aikacen masana'antu na farko a fannin sarrafa kayan aiki. IBM ta ba da rahoton amfani da na'urorin laser na femtosecond a cikin samar da abin rufe fuska a cikin shekarun 1990. Idan aka kwatanta da nanosecond laser ablation, wanda zai iya haifar da fashewar ƙarfe da lalacewar gilashi, abin rufe fuska na laser na femtosecond ba ya nuna fashewar ƙarfe, babu lalacewar gilashi, da sauransu. Fa'idodin. Ana amfani da wannan hanyar don samar da da'irori masu haɗawa (ICs). Samar da guntu na IC na iya buƙatar har zuwa abin rufe fuska 30 kuma farashin ya wuce $100,000. Sarrafa laser na Femtosecond na iya sarrafa layuka da maki ƙasa da 150nm.
Hoto na 1. Ƙirƙirar abin rufe fuska na hoto da gyara shi
Hoto na 2. Sakamakon ingantawa na nau'ikan abin rufe fuska daban-daban don lithography mai tsauri na ultraviolet
02 Yanke silicon a cikin masana'antar semiconductor
Tsarin yanka silicon wafer tsari ne na masana'antu na semiconductor kuma yawanci ana yin sa ne ta amfani da na'urar yankewa. Waɗannan ƙafafun yankewa galibi suna haifar da ƙananan fasa kuma suna da wahalar yankewa (misali kauri ƙasa da μm) wafers. An yi amfani da laser yanke silicon wafers a masana'antar semiconductor tsawon shekaru da yawa, musamman ga ƙananan wafers (100-200μm), kuma ana aiwatar da su ta matakai da yawa: yanke laser, sannan rabuwar injiniya ko yanke ɓoye (misali infrared laser beam a cikin silicon scribing) sannan rabuwar tef na injiniya. Laser nanosecond pulse laser na iya sarrafa wafers 15 a kowace awa, kuma laser picosecond zai iya sarrafa wafers 23 a kowace awa, tare da inganci mafi girma.
03 Yanke/rubutu a cikin masana'antar kayan lantarki masu amfani
Allon taɓawa da gilashin kariya ga wayoyin hannu da kwamfyutocin tafi-da-gidanka suna ƙara sirara kuma wasu siffofi na geometric sun lanƙwasa. Wannan yana sa yankewar injiniya ta gargajiya ta fi wahala. Lasers na yau da kullun galibi suna samar da ƙarancin ingancin yankewa, musamman lokacin da waɗannan allon gilashin suka kasance layuka 3-4 kuma an daidaita gilashin kariya mai kauri 700 μm sama, wanda zai iya karyewa tare da matsin lamba na gida. An nuna cewa lasers masu sauri suna iya yanke waɗannan gilashin da ƙarfi mafi kyau. Don babban yanke faifan lebur, ana iya mai da hankali kan laser na femtosecond akan bayan zanen gilashin, yana goge ciki na gilashin ba tare da lalata saman gaba ba. Sannan ana iya karya gilashin ta amfani da hanyoyin injiniya ko na zafi tare da tsarin da aka yi wa alama.
Hoto na 3. Gilashin Laser mai saurin gaske na Picosecond mai siffar musamman
04 Tsarin Piston a cikin masana'antar mota
An yi injunan mota masu sauƙi da ƙarfe na aluminum, waɗanda ba su da juriya ga lalacewa kamar ƙarfen siminti. Bincike ya gano cewa sarrafa laser na femtosecond na yanayin piston na mota na iya rage gogayya da har zuwa 25% saboda ana iya adana tarkace da mai yadda ya kamata.
Hoto na 4. Ana sarrafa fistan injin mota ta hanyar amfani da laser na Femtosecond don inganta aikin injin.
05 Kera stent na jijiyoyin zuciya a masana'antar likitanci
Ana dasa miliyoyin stent na zuciya a cikin jijiyoyin zuciya na jiki don buɗe hanyar jini ya kwarara zuwa cikin tasoshin da suka toshe, wanda hakan ke ceton miliyoyin rayuka kowace shekara. Ana yin stent na zuciya yawanci daga ƙarfe (misali, bakin ƙarfe, ƙarfe mai siffar nickel-titanium, ko kuma kwanan nan cobalt-chromium alloy) tare da faɗin strut na kusan 100 μm. Idan aka kwatanta da yanke laser mai tsayi, fa'idodin amfani da laser mai sauri don yanke maƙallan sune ingancin yankewa mai kyau, kyakkyawan ƙarewa a saman, da ƙarancin tarkace, wanda ke rage farashin sarrafawa.
06 Kera na'urorin Microfluidic don masana'antar likitanci
Ana amfani da na'urorin microfluidic a masana'antar likitanci don gwajin cututtuka da gano su. Yawanci ana ƙera su ta hanyar yin allurar micro-injection na sassan jikin mutum ɗaya sannan a haɗa su ta amfani da manne ko walda. Ƙirƙirar laser mai sauri na na'urorin microfluidic yana da fa'idar samar da ƙananan tashoshi na 3D a cikin kayan haske kamar gilashi ba tare da buƙatar haɗi ba. Hanya ɗaya ita ce ƙera laser mai sauri a cikin gilashin girma sannan a bi shi da etching na sinadarai masu danshi, wata kuma ita ce femtosecond laser ablation a cikin gilashi ko filastik a cikin ruwan da aka tace don cire tarkace. Wata hanyar kuma ita ce a yi amfani da hanyoyin injina a cikin gilashin sannan a rufe su da murfin gilashi ta hanyar walda laser na femtosecond.
Hoto na 6. Zaɓen femtosecond da laser ke haifarwa don shirya hanyoyin microfluidic a cikin kayan gilashi
07 Ƙaramin haƙa bututun allura
Injin laser na Femtosecond microhole ya maye gurbin micro-EDM a kamfanoni da yawa a kasuwar allurar mai matsin lamba saboda sassaucin da ake samu wajen canza bayanan ramukan kwarara da kuma gajerun lokutan injin. Ikon sarrafa matsayin mayar da hankali da karkatar da hasken ta atomatik ta hanyar kan na'urar daukar hoto mai shigarwa ya haifar da ƙirar bayanan budewa (misali, ganga, walƙiya, haɗuwa, bambance-bambance) wanda zai iya haɓaka atomization ko shiga cikin ɗakin konewa. Lokacin haƙa ya dogara da girman ablation, tare da kauri na haƙa rami na 0.2 - 0.5 mm da diamita na rami na 0.12 - 0.25 mm, wanda hakan ya sa wannan dabarar ta ninka sauri sau goma fiye da micro-EDM. Ana yin haƙa rami a matakai uku, gami da yin roughing da kammala ramukan ta hanyar gwaji. Ana amfani da Argon azaman iskar gas mai taimako don kare ramin daga iskar shaka da kuma kare plasma na ƙarshe a lokacin matakan farko.
Hoto na 7. Femtosecond laser mai inganci mai kyau na ramin taper mai juyawa don allurar injin dizal
08 Tsarin laser mai sauri sosai
A cikin 'yan shekarun nan, domin inganta daidaiton injina, rage lalacewar kayan aiki, da kuma ƙara ingancin sarrafawa, fannin sarrafa micro ya zama abin da masu bincike suka mayar da hankali a kai. Laser mai sauri yana da fa'idodi daban-daban na sarrafawa kamar ƙarancin lalacewa da babban daidaito, wanda ya zama babban abin da ke haɓaka haɓaka fasahar sarrafa kayan aiki. A lokaci guda, laser mai sauri na iya aiki akan nau'ikan kayan aiki daban-daban, kuma lalacewar kayan sarrafa laser shima babban alkibla ne na bincike. Ana amfani da Laser mai sauri don cire kayan aiki. Lokacin da yawan kuzarin laser ya fi matakin cire kayan aiki, saman kayan da aka cire zai nuna tsarin micro-nano tare da wasu halaye. Bincike ya nuna cewa wannan Tsarin saman musamman wani abu ne da ya zama ruwan dare gama gari wanda ke faruwa lokacin da kayan sarrafa laser ke aiki. Shirya tsarin micro-nano na saman zai iya inganta halayen kayan da kansa kuma yana ba da damar haɓaka sabbin kayan aiki. Wannan yana sa shirya tsarin micro-nano na saman ta hanyar laser mai sauri hanya ce ta fasaha tare da mahimmancin ci gaba. A halin yanzu, ga kayan ƙarfe, bincike kan yanayin laser mai sauri zai iya inganta halayen jika saman ƙarfe, inganta gogayya da lalacewar saman, haɓaka mannewar shafi, da yaduwar ƙwayoyin halitta da mannewa a hanya.
Hoto na 8. Abubuwan da suka fi kama da ruwa mai guba na saman silicon da aka shirya da laser
A matsayin fasahar sarrafa laser ta zamani, sarrafa laser mai sauri yana da halaye na ƙaramin yanki da zafi ya shafa, tsarin hulɗa mara layi na kayan aiki, da kuma sarrafa ƙuduri mai girma fiye da iyakar diffraction. Yana iya aiwatar da ingantaccen aiki mai inganci da daidaito na micro-nano na kayan aiki daban-daban. da kuma ƙirƙirar tsarin micro-nano mai girma uku. Samun nasarar kera laser na kayan aiki na musamman, tsare-tsare masu rikitarwa da na'urori na musamman yana buɗe sabbin hanyoyi don kera micro-nano. A halin yanzu, ana amfani da laser femtosecond sosai a fannoni da yawa na kimiyya: ana iya amfani da laser femtosecond don shirya na'urori daban-daban na gani, kamar su microlens arrays, bionic compound eyes, optical waveguides da metasurfaces; ta amfani da babban daidaito, babban ƙuduri da kuma Tare da ikon sarrafa abubuwa uku, laser femtosecond zai iya shirya ko haɗa kwakwalwan microfluidic da optofluidic kamar abubuwan da ke cikin microheater da tashoshin microfluidic masu girma uku; Bugu da ƙari, femtosecond laser kuma zai iya shirya nau'ikan ƙananan nanostructures daban-daban na saman don cimma nasarar hana tunani, hana tunani, super-hydrophobic, anti-ice da sauran ayyuka; ba wai kawai ba, an kuma yi amfani da femtosecond laser a fannin biomedicine, yana nuna kyakkyawan aiki a fannoni kamar ƙwayoyin halitta, substrates na al'adar tantanin halitta da hoton microscopic na halitta. Faɗaɗar aikace-aikacen. A halin yanzu, fannonin aikace-aikacen sarrafa laser na femtosecond suna faɗaɗa kowace shekara. Baya ga ƙananan na'urori masu gani, ƙananan nanostructures, ƙananan nanostructures masu aiki da yawa da aikace-aikacen injiniyan biomedical, yana kuma taka rawa sosai a wasu fannoni masu tasowa, kamar shirye-shiryen metasurface. , masana'antar micro-nano da adana bayanai masu girma dabam-dabam, da sauransu.
Lokacin Saƙo: Afrilu-17-2024
