Ko da yake ultrafast lasers sun kasance a kusa da shekaru da yawa, aikace-aikacen masana'antu sun girma cikin sauri a cikin shekaru ashirin da suka gabata. A cikin 2019, ƙimar kasuwa na ultrafastLaser abusarrafa ya kusan dalar Amurka miliyan 460, tare da haɓakar haɓakar haɓakar shekara-shekara na 13%. Yankunan aikace-aikacen da aka yi nasarar amfani da Laser na ultrafast don aiwatar da kayan masana'antu sun haɗa da ƙirar photomask da gyare-gyare a cikin masana'antar semiconductor da kuma dicing silicon, yankan gilashi / rubutun da (indium tin oxide) cire fim ɗin ITO a cikin kayan lantarki masu amfani kamar wayoyin hannu da Allunan. , Piston rubutu don masana'antar kera motoci, masana'antar stent na jijiyoyin jini da masana'antar microfluidic don masana'antar likitanci.
01 Photomask masana'antu da gyarawa a cikin masana'antar semiconductor
Ultrafast Laser da aka yi amfani a daya daga cikin farkon masana'antu aikace-aikace a kayan aiki. IBM ya ba da rahoton aikace-aikacen cirewar laser femtosecond a cikin samar da mashin hoto a cikin 1990s. Idan aka kwatanta da nanosecond Laser ablation, wanda zai iya samar da karfe spatter da gilashi lalacewa, femtosecond Laser masks nuna wani karfe spatter, babu gilashi lalacewa, da dai sauransu The abũbuwan amfãni. Ana amfani da wannan hanyar don samar da haɗin kai (ICs). Samar da guntu IC na iya buƙatar har zuwa abin rufe fuska 30 kuma farashi> $ 100,000. Ayyukan Laser na Femtosecond na iya aiwatar da layi da maki ƙasa da 150nm.
Hoto 1. Photomask ƙirƙira da gyarawa
Hoto 2. Sakamakon ingantawa na nau'ikan nau'ikan maskurin daban-daban don matsanancin lithography na ultraviolet
02 Yanke Silicon a cikin masana'antar semiconductor
Silicon wafer dicing shine daidaitaccen tsari na masana'antu a masana'antar semiconductor kuma yawanci ana yin ta ta amfani da dicing na inji. Waɗannan ƙafafunn yankan galibi suna haɓaka microcracks kuma suna da wahala a yanke siraran (misali kauri <150 μm) wafers. Laser yankan silicon wafers da aka yi amfani a cikin semiconductor masana'antu shekaru da yawa, musamman ga bakin ciki wafers (100-200μm), kuma da za'ayi a mahara matakai: Laser tsagi, bi da inji rabuwa ko stealth yankan (watau infrared Laser katako a ciki). rubutun silicon) ya biyo bayan rabuwar tef na inji. Laser pulse na nanosecond na iya sarrafa wafers 15 a cikin sa'a guda, kuma laser picosecond na iya sarrafa wafers 23 a cikin awa daya, tare da inganci mafi girma.
03 Gilashin yankan / rubutun rubutu a cikin masana'antar lantarki masu amfani
Abubuwan taɓa fuska da gilashin kariya na wayoyin hannu da kwamfyutoci suna ƙara ƙaranci kuma wasu siffofi na geometric suna lanƙwasa. Wannan ya sa yankan inji na gargajiya ya fi wahala. Laser na yau da kullun galibi suna samar da ƙarancin yanke ingancin, musamman lokacin da waɗannan nunin gilashin ke tattare da yadudduka 3-4 kuma saman gilashin kariya mai kauri na 700 μm yana da zafi, wanda zai iya karya tare da damuwa na gida. An nuna Laser na ultrafast don iya yanke waɗannan gilashin tare da kyakkyawan ƙarfin gefen. Don yankan babban lebur ɗin lebur, laser femtosecond za a iya mai da hankali kan bangon baya na takardar gilashin, yana zazzage cikin gilashin ba tare da lalata saman gaba ba. Ana iya karya gilashin ta amfani da injiniyoyi ko yanayin zafi tare da sifar da aka zana.
Hoto 3. Picosecond ultrafast Laser gilashin yankan-siffa na musamman
04 Piston laushi a cikin masana'antar kera motoci
An yi injunan mota masu nauyi da alluran allo, waɗanda ba su da juriya kamar simintin ƙarfe. Bincike ya gano cewa sarrafa Laser na femtosecond na kayan kwalliyar piston mota na iya rage juzu'i har zuwa 25% saboda ana iya adana tarkace da mai yadda ya kamata.
Hoto 4. Femtosecond Laser sarrafa pistons injin mota don inganta aikin injin
05 Masana'antar stent mai ɗaukar nauyi a cikin masana'antar likitanci
Miliyoyin ƙwararrun jijiyoyi ana dasa su a cikin jijiyoyi na jijiyoyin jini don buɗe hanyar da jini ke kwarara zuwa cikin tasoshin da ba su da jini, wanda ke ceton miliyoyin rayuka a kowace shekara. Nau'in stent yawanci ana yin su ne daga ƙarfe (misali, bakin ƙarfe, gami da siffar nickel-titanium, ko kuma kwanan nan cobalt-chromium gami) ragamar waya tare da faɗin strut kusan μm 100. Idan aka kwatanta da dogon-bugun jini Laser yankan, da abũbuwan amfãni daga yin amfani da ultrafast Laser don yanke brackets ne high yanke ingancin, mafi kyau surface gama, kuma kasa tarkace, wanda rage post-aiki halin kaka.
06 Kera na'urar microfluidic don masana'antar likita
Ana yawan amfani da na'urorin microfluidic a masana'antar likita don gwajin cututtuka da ganewar asali. Ana yin waɗannan yawanci ta hanyar gyare-gyaren ƙananan allura na sassa daban-daban sannan kuma a haɗa su ta amfani da gluing ko walda. Ƙirƙirar Laser Ultrafast na na'urorin microfluidic yana da fa'idar samar da microchannels na 3D a cikin kayan gaskiya kamar gilashin ba tare da buƙatar haɗi ba. Wata hanya ita ce ƙera laser ultrafast a cikin babban gilashin da ke biye da rigar sinadarai, wata kuma ita ce zubar da laser na femtosecond a cikin gilashin ko filastik a cikin ruwa mai narkewa don cire tarkace. Wata hanyar da za a bi ita ce tashoshi na inji a cikin saman gilashin kuma a rufe su da murfin gilashi ta hanyar walda na femtosecond Laser.
Hoto 6. Femtosecond Laser-induced selective etching don shirya microfluidic tashoshi a cikin kayan gilashi.
07 Micro hako bututun ƙarfe
Femtosecond Laser microhole machining ya maye gurbin micro-EDM a kamfanoni da yawa a cikin babban matsi na injector kasuwa saboda mafi girma sassauci a canza kwarara ramin profiles da guntu machining sau. Ikon sarrafa wurin mayar da hankali ta atomatik da karkatar da katako ta hanyar binciken da aka rigaya ya haifar da ƙirƙira bayanan bayanan buɗaɗɗen (misali, ganga, walƙiya, haɗuwa, rarrabuwa) wanda zai iya haɓaka atomization ko shiga cikin ɗakin konewa. Lokacin hakowa ya dogara da ƙarar ablation, tare da kauri na 0.2 - 0.5 mm da diamita na 0.12 - 0.25 mm, yin wannan fasaha sau goma da sauri fiye da micro-EDM. Ana yin microdrilling a matakai uku, gami da roughing da kammala ramukan matukin jirgi. Ana amfani da Argon azaman iskar gas don kare rijiyar burtsatse daga iskar oxygen da kuma kare plasma na ƙarshe yayin matakan farko.
Hoto 7. Femtosecond Laser high-daidaici aiki na inverted taper rami don injector dizal engine
08 Ultra-sauri Laser rubutu
A cikin 'yan shekarun nan, don inganta daidaiton mashin ɗin, rage lalacewar kayan aiki, da haɓaka ingantaccen aiki, fannin micromachining ya zama mai da hankali kan masu bincike a hankali. Ultrafast Laser yana da daban-daban aiki abũbuwan amfãni kamar low lalacewa da kuma high daidaici, wanda ya zama mayar da hankali na inganta ci gaban da fasaha fasaha. A lokaci guda, ultrafast lasers na iya yin aiki akan nau'ikan kayan aiki, kuma lalacewar sarrafa kayan aikin laser shima babban jagorar bincike ne. Ana amfani da Laser Ultrafast don cire kayan. Lokacin da ƙarfin makamashi na Laser ya fi girma fiye da ƙaddamarwa na kayan abu, saman kayan da aka lalata zai nuna tsarin micro-nano tare da wasu halaye. Bincike ya nuna cewa wannan Tsarin saman na musamman al'amari ne na kowa wanda ke faruwa a lokacin da kayan sarrafa Laser. Shirye-shiryen sifofin micro-nano na saman zai iya inganta kaddarorin kayan da kanta kuma yana ba da damar haɓaka sabbin kayan. Wannan ya sa shirye-shirye na surface micro-nano Tsarin ta ultrafast Laser wani fasaha hanya tare da muhimmanci ci gaban muhimmancin. A halin yanzu, don karfe kayan, bincike a kan ultrafast Laser surface texturing iya inganta karfe surface wetting Properties, inganta surface gogayya da sa kaddarorin, inganta shafi mannewa, da directional yaduwa da mannewa na sel.
Hoto 8. Superhydrophobic Properties na Laser-shirye silicon surface
A matsayin fasaha na fasaha mai mahimmanci, ultrafast Laser aiki yana da halaye na ƙananan yankin da ke fama da zafi, tsarin da ba na layi ba tare da kayan aiki, da kuma aiki mai mahimmanci fiye da iyakacin iyaka. Yana iya gane high quality-da high-madaidaici micro-nano sarrafa daban-daban kayan. da ƙirƙira ƙirar micro-nano mai girma uku. Samun Laser masana'antu na musamman kayan, hadaddun Tsarin da na musamman na'urorin bude up sabon hanyoyin da micro-nano masana'antu. A halin yanzu, femtosecond Laser da aka yadu amfani a da yawa yankan-baki kimiyya filayen: femtosecond Laser za a iya amfani da daban-daban Tantancewar na'urorin, kamar microlens tsararru, bionic fili idanu, na gani waveguides da metasurfaces; ta yin amfani da madaidaicin madaidaicin sa, babban ƙuduri kuma Tare da ikon sarrafawa mai girma uku, femtosecond Laser zai iya shirya ko haɗa microfluidic da kwakwalwan kwamfuta na optofluidic irin su microheater abubuwan da aka gyara da kuma tashoshi na microfluidic uku; Bugu da kari, femtosecond Laser kuma iya shirya daban-daban na surface micro-nanostructures don cimma anti-waiwaye , anti-tunani, super-hydrophobic, anti-icing da sauran ayyuka; Ba wai kawai ba, an kuma yi amfani da Laser femtosecond a fagen nazarin halittu, yana nuna kyakkyawan aiki a fannoni kamar micro-stents na nazarin halittu, abubuwan al'adun tantanin halitta da hoto na microscopic na halitta. Faɗin aikace-aikacen bege. A halin yanzu, filayen aikace-aikacen na sarrafa Laser femtosecond suna haɓaka kowace shekara. Baya ga abubuwan da aka ambata a sama, micro-optics, microfluidics, micro-nanostructures masu aiki da yawa da aikace-aikacen injiniyan halittu, yana kuma taka rawa sosai a wasu fagage masu tasowa, kamar shirye-shiryen metasurface. , Micro-nano masana'antu da Multi-girma na gani bayanai ajiya, da dai sauransu.
Lokacin aikawa: Afrilu-17-2024
